Double Coated Tissue Tape for PU Connection Tape in CMP
CDR-P2565R
Double Coated Tissue Tape for PU Connection Tape in CMP
Product Overview
Our high-performance double-sided tape is specifically designed for the Chemical Mechanical Planarization (CMP) process in semiconductor manufacturing, making it particularly suitable for securing and stabilizing diamond disks. This product features outstanding heat resistance, chemical stability, and exceptional adhesion strength, ensuring that the diamond disk remains firmly in place even under high-speed operation and prolonged use.
Product Features & Advantages
✅ Superior Durability – Withstands high temperatures and harsh chemical environments in the CMP process, ensuring long-term stability.
✅ High Adhesion Strength – Designed specifically for diamond disks, ensuring a secure bond to prevent detachment or misalignment during processing.
✅ Precision Thickness Control – Available in multiple thickness specifications to maintain process consistency and accuracy.
✅ Low Residue Technology – Enables clean and efficient removal, reducing residue buildup and improving process efficiency.
Industry Validation & Application
This product has been successfully implemented in leading semiconductor manufacturers' CMP processes and has received high recognition. Our double-sided tape meets the stringent requirements of the CMP process and has been validated in advanced manufacturing applications, demonstrating exceptional reliability and stability.
Applications
✔ Diamond disk fixation
✔ CMP dressing process
✔ Other high-precision semiconductor processing applications
Features
- High initial tack and adhesion bonding low surface energy material, such as EVA form
- Excellent cold shock performance
- High humidity and UV resistance
Recommended Applications
- ✔ Diamond disk fixation,✔ CMP dressing process,✔ Other high-precision semiconductor processing applications
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Press Release
- New PPF Developing
Cutting Age PPF is Under Development, TPU PPF's performance with reasonable price.
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